IP Verse

Extrudable Hot Melt Pressure Sensitive Adhesives For Resealable Packaging Having Improved Organoleptic Properties - EP2966140

PATENT ANALYSIS

Patent Details

Grant Date
May 10, 2017
Company
BOSTIK SA
Oppositions

LEHMANN&VOSS&CO. KG

More patents of Bostik Sa

EP2949676

EP3159388

EP3024856

Want to monitor this patent?

Feel free to send us a message here and we will get back to you