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Method Of Molding Rigid Polyurethane Foams With Enhanced Thermal Conductivity - EP1951777

The patent EP1951777 was granted to DOW on May 17, 2017. The application was originally filed on Nov 3, 2006 under application number EP06827462A. The patent is currently recorded with a legal status of "Opposition Rejected".

EP1951777

DOW
Application Number
EP06827462A
Filing Date
Nov 3, 2006
Status
Opposition Rejected
Apr 28, 2023
Publication Date
May 17, 2017
External Links
Slate, Register, Google Patents

Patent Summary

Patent Family

Patent Family

Patent Oppositions (2)

Patent oppositions filed by competitors challenge the validity of a granted patent. These oppositions are typically based on claims of prior art, lack of novelty, or non-obviousness. They are a key part of the process for determining a patent's strength and enforceability.

CompanyOpposition DateRepresentativeOpposition Status

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BASFFeb 16, 2018ALTMANN STOSSEL DICK PATENTANWALTE PARTG MBBADMISSIBLE
COVESTRO DEUTSCHLAND AGCOVESTROFeb 7, 2018-ADMISSIBLE

Patent Citations (8) New

Patent citations refer to prior patents cited during different phases such as opposition or international search.

Citation PhasePublication Number
INTERNATIONAL-SEARCH-REPORTEP0708127
INTERNATIONAL-SEARCH-REPORTUS3970732
INTERNATIONAL-SEARCH-REPORTUS5530033
OPPOSITIONEP0477920
OPPOSITIONEP0708127
OPPOSITIONUS3970732
OPPOSITIONUS5523334
OPPOSITIONWO2004035650

Dossier Documents

The dossier documents provide a comprehensive record of the patent's prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent's legal journey and any challenges it may have faced during examination.

  • Date

    Description

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