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Solid Thermally Expansible Material - EP1966267

The patent EP1966267 was granted to Sika Technology on Jul 16, 2025. The application was originally filed on Jun 30, 2006 under application number EP06765982A. The patent is currently recorded with a legal status of "Patent Maintained As Amended".

EP1966267

SIKA TECHNOLOGY
Application Number
EP06765982A
Filing Date
Jun 30, 2006
Status
Patent Maintained As Amended
Jun 13, 2025
Publication Date
Jul 16, 2025
External Links
Slate, Register, Google Patents

Patent Summary

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Patent Family

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L & L PRODUCTS EUROPESep 13, 2018KUTZENBERGER WOLFF & PARTNERADMISSIBLE

Patent Citations (44) New

Patent citations refer to prior patents cited during different phases such as opposition or international search.

Citation PhasePublication Number
EXAMINATIONEP0899300
EXAMINATIONUS2004221953
EXAMINATIONUS6150428
EXAMINATIONWO9637400
INTERNATIONAL-SEARCH-REPORTWO0224451
INTERNATIONAL-SEARCH-REPORTWO03026947
INTERNATIONAL-SEARCH-REPORTWO03042024
INTERNATIONAL-SEARCH-REPORTWO9719124
OPPOSITIONEP0775721
OPPOSITIONEP0798354
OPPOSITIONEP0899300
OPPOSITIONEP1090813
OPPOSITIONEP1728825
OPPOSITIONEP1741734
OPPOSITIONJPS59179536
OPPOSITIONUS2004058181
OPPOSITIONUS2004131840
OPPOSITIONUS2004221953
OPPOSITIONUS2004266898
OPPOSITIONUS2004266899
OPPOSITIONUS2005159511
OPPOSITIONUS5274006
OPPOSITIONUS6150428
OPPOSITIONUS6218442
OPPOSITIONUS6348513
OPPOSITIONUS6376564
OPPOSITIONUS6387470
OPPOSITIONUS6403222
OPPOSITIONUS6403669
OPPOSITIONUS6479560
OPPOSITIONUS6887914
OPPOSITIONWO02088214
OPPOSITIONWO0224451
OPPOSITIONWO03026947
OPPOSITIONWO03042024
OPPOSITIONWO03093387
OPPOSITIONWO2004055092
OPPOSITIONWO2007012048
OPPOSITIONWO9637400
OPPOSITIONWO9719124
SEARCHWO0224451
SEARCHWO03026947
SEARCHWO03042024
SEARCHWO9719124

Non-Patent Literature (NPL) Citations (9) New

NPL citations refer to non-patent references such as research papers, articles, or other publications cited during examination or opposition phases.

Citation PhaseReference Text
OPPOSITION- Experimental Data
OPPOSITION- J.H. HODGKIN et al., "Thermoplastic toughening of epoxy resins: a critical review", Polymers for Advances Technologies, (19981204), vol. 9, pages 3 - 10
OPPOSITION- J.K. FINK et al., "Epoxy Resins", Reactive Polymers - Fundamentals and Applications, William Andrew, (20050715), pages 151 - 159
OPPOSITION- J.K. FINK et al., "Epoxy Resins", Reactive Polymers - Fundamentals and Applications, William Andrew, (20050715), pages 151 - 159, XP055519567
OPPOSITION- RAJ B. DURAIRAJ, "7.7 Epoxy Resins", Resorcinol: Chemistry, Technology and Applications, Springer, (20050726), pages 455 - 457
OPPOSITION- R S Raghava, "Toughened Thermosetting Matrices and Their Composites", R S Raghava, S.M. LEE, Reference Book For Composites Technology 1, (19890000), vol. 5, pages 79 - 96
OPPOSITION- R S Raghava, "Toughened Thermosetting Matrices and Their Composites", R S Raghava, S.M. LEE, Reference Book For Composites Technology 1, (19890000), vol. 5, pages 79 - 96, XP055487670
OPPOSITION- J.H. HODGKIN et al., "Thermoplastic toughening of epoxy resins: a critical review", Polymers for Advances Technologies, (19981204), vol. 9, pages 3 - 10, XP000727924
OPPOSITION- RAJ B. DURAIRAJ, "7.7 Epoxy Resins", Resorcinol: Chemistry, Technology and Applications, Springer, (20050726), pages 455 - 457, XP055519564

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