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Plating Solution For Electroless Deposition Of Copper - EP2016207B1
EP2016207
- Application Number
- EP07762101A
- Filing Date
- May 10, 2007
- Status
- No Opposition Filed Within Time Limit
- Nov 16, 2018
- Grant Date
- Jan 10, 2018
- External Links
- Slate, Register, Google Patents
Bibliography
The patent EP2016207B1 was granted to LAM Research on Jan 10, 2018 following the initial filing on May 10, 2007 under the application number EP07762101A . The current legal status of the patent is No Opposition Filed Within Time Limit.
Patent Summary
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Dossier Documents
The dossier documents provide a comprehensive record of the patent’s prosecution history, including filings, correspondence, and decisions made by patent offices. These documents are crucial for understanding the patent’s legal journey and any challenges it may have faced during examination. It also includes the oppositions documents filed against the patent.
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