Plating Solution For Electroless Deposition Of Copper - EP2016207
The patent EP2016207 was granted to LAM Research on Jan 10, 2018. The application was originally filed on May 10, 2007 under application number EP07762101A. The patent is currently recorded with a legal status of "No Opposition Filed Within Time Limit".
EP2016207
- Application Number
- EP07762101A
- Filing Date
- May 10, 2007
- Status
- No Opposition Filed Within Time Limit
- Nov 16, 2018
- Grant Date
- Jan 10, 2018
- External Links
- Slate, Register, Google Patents
Patent Summary
Patent Family
Dossier Documents
The dossier documents provide a comprehensive record of the patent’s prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent’s legal journey and any challenges it may have faced during examination.
Date
Description
Get instant alerts for new documents