Ground Bonding Connection - EP2121387
The patent EP2121387 was granted to Conti Temic Microelectronic on Jan 10, 2018. The application was originally filed on Mar 11, 2008 under application number EP08734368A. The patent is currently recorded with a legal status of "No Opposition Filed Within Time Limit".
EP2121387
- Application Number
- EP08734368A
- Filing Date
- Mar 11, 2008
- Status
- No Opposition Filed Within Time Limit
- Nov 16, 2018
- Grant Date
- Jan 10, 2018
- External Links
- Slate, Register, Google Patents
Patent Summary
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Dossier Documents
The dossier documents provide a comprehensive record of the patent’s prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent’s legal journey and any challenges it may have faced during examination.
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