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Ground Bonding Connection - EP2121387B1
EP2121387
- Application Number
- EP08734368A
- Filing Date
- Mar 11, 2008
- Status
- No Opposition Filed Within Time Limit
- Nov 16, 2018
- Grant Date
- Jan 10, 2018
- External Links
- Slate, Register, Google Patents
- Similar Patents facing opposition
Bibliography
The patent EP2121387B1 was granted to Conti Temic Microelectronic on Jan 10, 2018 following the initial filing on Mar 11, 2008 under the application number EP08734368A . The current legal status of the patent is No Opposition Filed Within Time Limit.
Patent Summary
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Dossier Documents
The dossier documents provide a comprehensive record of the patent’s prosecution history, including filings, correspondence, and decisions made by patent offices. These documents are crucial for understanding the patent’s legal journey and any challenges it may have faced during examination. It also includes the oppositions documents filed against the patent.
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