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Molding Material For Md Shrink And Md Shrink Film - EP2138541B2

EP2138541

DENKA
Application Number
EP08711586A
Filing Date
Feb 19, 2008
Status
Patent Maintained As Amended
Jan 31, 2020
Grant Date
Mar 4, 2020
External Links
Slate, Register, Google Patents
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The patent EP2138541B2 was granted to Denka on Mar 4, 2020 following the initial filing on Feb 19, 2008 under the application number EP08711586A . The current legal status of the patent is Patent Maintained As Amended.

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INEOS STYROLUTION GROUPMay 2, 2018 -

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