IP Verse

Power Semiconductor Module And Its Attachment Structure - EP2500939

The patent EP2500939 was granted to Mitsubishi Electric on May 7, 2025. The application was originally filed on Aug 10, 2011 under application number EP11177061A. The patent is currently recorded with a legal status of "Patent Maintained As Amended".

EP2500939

MITSUBISHI ELECTRIC
Application Number
EP11177061A
Filing Date
Aug 10, 2011
Status
Patent Maintained As Amended
Apr 4, 2025
Grant Date
May 7, 2025
External Links
Slate, Register, Google Patents

Patent Summary

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Patent Family

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VALEO SYSTEMES DE CONTROLE MOTEURSep 25, 2019VALEO POWERTRAIN SYSTEMSADMISSIBLE

Patent Citations (26) New

Patent citations refer to prior patents cited during different phases such as opposition or international search.

Citation PhasePublication NumberPublication Link
DESCRIPTIONJP4540884B
EXAMINATIONDE19700056
OPPOSITIONDE19700056
OPPOSITIONEP2028692
OPPOSITIONEP2674973
OPPOSITIONGB920411
OPPOSITIONJP2005327791
OPPOSITIONJP2008141140
OPPOSITIONJP2010114257
OPPOSITIONUS2002012231
OPPOSITIONUS2003168731
OPPOSITIONUS2004017656
OPPOSITIONUS2005104168
OPPOSITIONUS2005161785
OPPOSITIONUS5075759
OPPOSITIONUS5216283
OPPOSITIONUS5703399
OPPOSITIONUS5781412
OPPOSITIONUS5793106
OPPOSITIONUS6933593
OPPOSITIONUS6979909
OPPOSITIONUS7714455
SEARCHEP2028692
SEARCHUS2004017656
SEARCHUS2005104168
SEARCHUS2005161785

Non-Patent Literature (NPL) Citations (2) New

NPL citations refer to non-patent references such as research papers, articles, or other publications cited during examination or opposition phases.

Citation PhaseReference TextLink
OPPOSITION- Motto E., Donlon J., Shang Ming, Kuriaki Kazuhiro, Iwagami Toru, Kawafuji Hisashi, Nakano Toshiya, "Large Package Transfer Molded DIP-IPM", IEEE Industry Applications Society Annual Meeting, (20080000), doi:10.1109/08IAS.2008.12, ISBN 978-1-4244-2278-4, pages 1 - 5, XP031353736-
OPPOSITION- "Power Modules for Motor Control Applications", Power Electronics Europe, (20100818), no. 5, XP055635423-

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Dossier Documents

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