Copper Alloy And Copper Alloy Forming Material - EP2781611
The patent EP2781611 was granted to Mitsubishi Materials on Jan 3, 2018. The application was originally filed on Nov 6, 2012 under application number EP12849153A. The patent is currently recorded with a legal status of "No Opposition Filed Within Time Limit".
EP2781611
- Application Number
- EP12849153A
- Filing Date
- Nov 6, 2012
- Status
- No Opposition Filed Within Time Limit
- Nov 9, 2018
- Grant Date
- Jan 3, 2018
- External Links
- Slate, Register, Google Patents
Patent Summary
Patent Family
Dossier Documents
The dossier documents provide a comprehensive record of the patent’s prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent’s legal journey and any challenges it may have faced during examination.
Date
Description
Get instant alerts for new documents