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IP Verse

Flexible Substrate With Integrated Circuit - EP2844487

The patent EP2844487 was granted to Hewlett Packard on Mar 9, 2022. The application was originally filed on Apr 30, 2012 under application number EP12875785A. The patent is currently recorded with a legal status of "The Patent Has Been Limited".

EP2844487

HEWLETT PACKARD
Application Number
EP12875785A
Filing Date
Apr 30, 2012
Status
The Patent Has Been Limited
May 18, 2018
Publication Date
Mar 9, 2022
External Links
Slate, Register, Google Patents

Patent Summary

Patent Family

Patent Family

Patent Oppositions

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ARTECH DESIGN PRODUCTION IN PLASTICMay 16, 2018-ADMISSIBLE

Patent Citations (16) New

Patent citations refer to prior patents cited during different phases such as opposition or international search.

Citation PhasePublication Number
INTERNATIONAL-SEARCH-REPORTUS2004189758
INTERNATIONAL-SEARCH-REPORTUS2006125893
INTERNATIONAL-SEARCH-REPORTUS6375298
INTERNATIONAL-SEARCH-REPORTWO9605061
OPPOSITIONEP0940259
OPPOSITIONGB2354735
OPPOSITIONUS2004223011
OPPOSITIONUS2010328405
OPPOSITIONUS5610635
OPPOSITIONUS6238038
OPPOSITIONUS6374354
OPPOSITIONUS6641254
OPPOSITIONUS6738903
OPPOSITIONUS7658470
OPPOSITIONWO2013165373
SEARCHUS5610635

Dossier Documents

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    Description

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