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Flexible Substrate With Integrated Circuit - EP2844487B2

EP2844487

HEWLETT PACKARD
Application Number
EP12875785A
Filing Date
Apr 30, 2012
Status
The Patent Has Been Limited
May 18, 2018
Grant Date
Mar 9, 2022
External Links
Slate, Register, Google Patents
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The patent EP2844487B2 was granted to Hewlett Packard on Mar 9, 2022 following the initial filing on Apr 30, 2012 under the application number EP12875785A . The current legal status of the patent is The Patent Has Been Limited.

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ARTECH DESIGN PRODUCTION IN PLASTICMay 16, 2018ADMISSIBLE

Dossier Documents

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