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Resin Composition, Prepreg, Metal Foil-Clad Laminate And Printed Wiring Board - EP2860219B1
EP2860219
- Application Number
- EP13804513A
- Filing Date
- Jun 6, 2013
- Status
- No Opposition Filed Within Time Limit
- Nov 16, 2018
- Grant Date
- Jan 10, 2018
- External Links
- Slate, Register, Google Patents
- Similar Patents facing opposition
Bibliography
The patent EP2860219B1 was granted to Mitsubishi GAS Chemical on Jan 10, 2018 following the initial filing on Jun 6, 2013 under the application number EP13804513A . The current legal status of the patent is No Opposition Filed Within Time Limit.
Patent Summary
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Dossier Documents
The dossier documents provide a comprehensive record of the patent’s prosecution history, including filings, correspondence, and decisions made by patent offices. These documents are crucial for understanding the patent’s legal journey and any challenges it may have faced during examination. It also includes the oppositions documents filed against the patent.
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