IP Verse

Interposer Stack Inside A Substrate For A Hearing Assistance Device - EP2919487

The patent EP2919487 was granted to Link on Feb 28, 2018. The application was originally filed on Mar 13, 2015 under application number EP15159010A. The patent is currently recorded with a legal status of "Revoked".

EP2919487

LINK
Application Number
EP15159010A
Filing Date
Mar 13, 2015
Status
Revoked
Apr 2, 2022
Grant Date
Feb 28, 2018
External Links
Slate, Register, Google Patents

Patent Summary

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GN HEARING WIDEX OTICONNov 28, 2018BETTEN & RESCH -

Patent Citations (12) New

Patent citations refer to prior patents cited during different phases such as opposition or international search.

Citation PhasePublication NumberPublication Link
OPPOSITIONEP1951015
OPPOSITIONEP2290687
OPPOSITIONUS2010081236
OPPOSITIONUS2010158296
OPPOSITIONUS6133626
OPPOSITIONUS7382056
OPPOSITIONWO2010075331
SEARCHEP2290687
SEARCHUS2007108583
SEARCHUS2010158296
SEARCHUS2013343564
SEARCHUS6133626

Non-Patent Literature (NPL) Citations (9) New

NPL citations refer to non-patent references such as research papers, articles, or other publications cited during examination or opposition phases.

Citation PhaseReference TextLink
OPPOSITION- "Chapter 1", JOHN H. LAU, Through-Silicon Vias for 3D Integration, Mc Graw Hill, (20130000), pages 1, 20 - 43, XP055746024-
OPPOSITION- K. ITOI, "Laminate Based Fan-out Embedded Die Packaging Using Polyimide Multilayer Wiring Boards", Proceedings of the 8th International Wafer Level Packaging Conference, (20111003), XP055535935-
OPPOSITION- Pizzagalli A. et al, "3D Silicon & Glass Interposers", Yole Développement SARL, (20120800), URL: http://www.chipscalereview.com/legacy/www.i-micronews.com/upload/Rapports/3D_Silicon &Glass_Interposers_sample_2012.pdf, XP055709391-
OPPOSITION- Semiconductor Components Industries, LLC, "Solving the Hearing Aid Platform Puzzle - Seven Things Hearing Aid Manufacturers Should Think About", Technical Note TND6092/D, (20140200), pages 1 - 11, URL: https://www.onsemi.com/pub/Collateral/TND6092-D.PDF-
OPPOSITION- S. JOHANSSON et al., "Ultra Small Hearing Aid Electronic Packaging Enabled by Chip-In-Flex", 64th Proceedings of IEEE Electronic Components & Technology Conference, (20140528), XP055535949-
OPPOSITION- SUSIE JOHANSSON, "Embedding Active and Passive Devices in Medical Electronics", IMAPS 2014 Device Packaging Conference , IMAPS 10th International Conference on Device Packaging I, (20130310), pages 000786 - 000814, XP055535944-
OPPOSITION- TERRY (TECKGYU) KANG et al., "A Comparison of Low Cost Interposer Technologies", IEEE/CPMT Luncheon Meeting, Santa Clara Valley, (20130523), URL: http://www.cpmt.org/scv/meetings/cpmt1305l.html, XP055746028-
OPPOSITION- REN-SHIN CHENG et al., "Process Characteristics of a 2.5D Silicon Module Using Embedded Technology as a Feasible Solution for System Integration and Thinner Form-Factor", IEEE 63rd Electronic Components and Technology Conference, (20130528), XP055535937
OPPOSITION- LAU, J., "Redistribution Layers (RDLs) for 2.5D/3D IC Integration", Journal of Microelectronics and Electronic Packaging, Orlando, FL, ISSN 1551-4897, (20140101), pages 16 - 24, URL: https://www.researchgate.net/publication/284356004_Redistribution_layers_RDLs_for_25D3D_IC_integration, XP009519700

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