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Method For Manufacturing Bonded Body And Method For Manufacturing Power-Module Substrate - EP2978019B1
EP2978019
- Application Number
- EP14769861A
- Filing Date
- Mar 17, 2014
- Status
- No Opposition Filed Within Time Limit
- Dec 7, 2018
- Grant Date
- Jan 31, 2018
- External Links
- Slate, Register, Google Patents
- Similar Patents facing opposition
Bibliography
The patent EP2978019B1 was granted to Mitsubishi Materials on Jan 31, 2018 following the initial filing on Mar 17, 2014 under the application number EP14769861A . The current legal status of the patent is No Opposition Filed Within Time Limit.
Patent Summary
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Dossier Documents
The dossier documents provide a comprehensive record of the patent’s prosecution history, including filings, correspondence, and decisions made by patent offices. These documents are crucial for understanding the patent’s legal journey and any challenges it may have faced during examination. It also includes the oppositions documents filed against the patent.
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