Method For Manufacturing Bonded Body And Method For Manufacturing Power-Module Substrate - EP2978019
The patent EP2978019 was granted to Mitsubishi Materials on Jan 31, 2018. The application was originally filed on Mar 17, 2014 under application number EP14769861A. The patent is currently recorded with a legal status of "No Opposition Filed Within Time Limit".
EP2978019
- Application Number
- EP14769861A
- Filing Date
- Mar 17, 2014
- Status
- No Opposition Filed Within Time Limit
- Dec 7, 2018
- Grant Date
- Jan 31, 2018
- External Links
- Slate, Register, Google Patents
Patent Summary
Patent Family
Dossier Documents
The dossier documents provide a comprehensive record of the patent’s prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent’s legal journey and any challenges it may have faced during examination.
Date
Description
Get instant alerts for new documents