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Production Of 3D Free-Form Waveguide Structures - EP2978593

The patent EP2978593 was granted to Karlsruher Institut FR Technologie KIT on Sep 27, 2017. The application was originally filed on Mar 28, 2014 under application number EP14714177A. The patent is currently recorded with a legal status of "Opposition Rejected".

EP2978593

KARLSRUHER INSTITUT FR TECHNOLOGIE KIT
Application Number
EP14714177A
Filing Date
Mar 28, 2014
Status
Opposition Rejected
Jan 29, 2021
Grant Date
Sep 27, 2017
External Links
Slate, Register, Google Patents

Patent Summary

Patent Family

Patent Family

Patent Oppositions (2)

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CompanyOpposition DateRepresentativeOpposition Status

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MULTIPHOTON OPTICSJun 27, 2018STREHL & PARTNERADMISSIBLE
MULTIPHOTON OPTICSJun 27, 2018STREHL SCHUBEL HOPF & PARTNERADMISSIBLE

Patent Citations (8) New

Patent citations refer to prior patents cited during different phases such as opposition or international search.

Citation PhasePublication NumberPublication Link
INTERNATIONAL-SEARCH-REPORTEP1635202
INTERNATIONAL-SEARCH-REPORTJPH07100938
INTERNATIONAL-SEARCH-REPORTUS7039264
OPPOSITIONDE102007038642
OPPOSITIONEP1635202
OPPOSITIONEP1846527
OPPOSITIONWO2009021256
OPPOSITIONWO2014108538

Non-Patent Literature (NPL) Citations (5) New

NPL citations refer to non-patent references such as research papers, articles, or other publications cited during examination or opposition phases.

Citation PhaseReference TextLink
OPPOSITION- TANAKA et al., "Rapid sub-diffraction-limit laser micro/nanoprocessing in a threshold material system", Applied Physics Letters, (20020114), vol. 80, no. 2, pages 312 - 314, XP012030919
OPPOSITION- J. SERBIN et al., "Three-dimensional nanostructuring of hybrid materials by two-photon polymerization SPIE Nanocrystals", Organic and Hybrid Nanomaterials, San Diego, (20030000), vol. 4, pages 171 - 177, XP055512777
OPPOSITION- RUTH HOUBERTZ et al., "Advanced packaging materials for optical applications: bridging the gap between nm-size structures and large-area panel processing", Proc. SPIE 6126, Photonics Packaging and Integration VI, (20060228), vol. 612605, XP055468518
OPPOSITION- N. LINDENMANN et al., "Photonic wire bonding: a novel concept for chip-scale interconnects", Opt. Express, (20120000), vol. 20, no. 16, pages 17667 - 17677, XP002729710
OPPOSITION- HOUBERTZ, R. et al., "Optical Waveguides Embedded in PCBs - A Real World Application of 3D Structures Written by TPA", MRS Proceedings, vol. 1054, (20070000), (20110201), XP055512781

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Dossier Documents

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