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A Semiconductor Bump-Bonded X-Ray Imaging Device - EP3105794

The patent EP3105794 was granted to Ajat on Aug 9, 2017. The application was originally filed on Mar 23, 2015 under application number EP15713670A. The patent is currently recorded with a legal status of "Revoked".

EP3105794

AJAT
Application Number
EP15713670A
Filing Date
Mar 23, 2015
Status
Revoked
Apr 22, 2024
Grant Date
Aug 9, 2017
External Links
Slate, Register, Google Patents

Patent Summary

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ESPATENTMay 7, 2018ESPATENT -

Patent Citations (7) New

Patent citations refer to prior patents cited during different phases such as opposition or international search.

Citation PhasePublication NumberPublication Link
INTERNATIONAL-SEARCH-REPORTDE102008050838
INTERNATIONAL-SEARCH-REPORTUS2001040290
INTERNATIONAL-SEARCH-REPORTUS2003155516
INTERNATIONAL-SEARCH-REPORTUS2006051954
INTERNATIONAL-SEARCH-REPORTWO03077319
OPPOSITIONUS7902666
OPPOSITIONWO03077319

Non-Patent Literature (NPL) Citations (2) New

NPL citations refer to non-patent references such as research papers, articles, or other publications cited during examination or opposition phases.

Citation PhaseReference TextLink
OPPOSITION- WEI KOH et al., "Copper Pillar Bump Technology Progress Overview", International Conference on Electronic Packaging Technology & High Density Packaging, (20110311), pages 1133 - 1137, XP055489217-
OPPOSITION- K. SPARTIOTIS et al., "A directly converting high-resolution intra-oral X-ray imaging sensor", Nucl. Instr. Meth. Phys. Res. A, (20030104), vol. 501, pages 594 - 601, XP004420464

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