Copper Ceramic Composite - EP3210956

The patent EP3210956 was granted to Heraeus Deutschland on Apr 11, 2018. The application was originally filed on Feb 26, 2016 under application number EP16157497A. The patent is currently recorded with a legal status of "Granted And Under Opposition".

EP3210956

HERAEUS DEUTSCHLAND
Application Number
EP16157497A
Filing Date
Feb 26, 2016
Status
Granted And Under Opposition
Mar 9, 2018
Grant Date
Apr 11, 2018
External Links
Slate, Register, Google Patents

Patent Summary

Patent Family

Patent Family

Patent Oppositions

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CompanyOpposition DateRepresentativeOpposition Status

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ROGERS GERMANYJan 11, 2019MULLER SCHUPFNER & PARTNER PATENT UND RECHTSANWALTSPARTNERSCHAFT MBB MUCWITHDRAWN

Patent Citations (21) New

Patent citations refer to prior patents cited during different phases such as opposition or international search.

Citation PhasePublication NumberPublication Link
DESCRIPTIONDE102004012231
DESCRIPTIONDE102012110322
DESCRIPTIONDE19927046
DESCRIPTIONDE2319854
DESCRIPTIONDE4004844
DESCRIPTIONDE4318241
DESCRIPTIONDE4319944
DESCRIPTIONEP0085914
DESCRIPTIONUS3744120
DESCRIPTIONUS3994430
OPPOSITIONDE102004012231
OPPOSITIONDE102004056879
OPPOSITIONDE102009033029
OPPOSITIONDE102012110322
OPPOSITIONDE102013104739
OPPOSITIONDE102013113736
OPPOSITIONDE19927046
OPPOSITIONDE2319854
OPPOSITIONJP2011124585
SEARCHEP1434265
SEARCHWO2013015355

Non-Patent Literature (NPL) Citations (4) New

NPL citations refer to non-patent references such as research papers, articles, or other publications cited during examination or opposition phases.

Citation PhaseReference TextLink
OPPOSITION- "8D-Report", Curamik, (20131016), pages 1 - 13, XP055550692-
OPPOSITION- "Analyse der Verbindungsschicht bei auffälligen AIN- DCB Messungen der Al2O3 Oxidschichtdicke zwischen Cu und AIN", Continental, (20130000), pages 1 - 3, XP055550094-
OPPOSITION- anonymous, "IGBT4 FS100R12PT4 EconoPACK4", System Plus Consulting - Reverse coating Analysis, (201411), XP055662137-
OPPOSITION- "DCB-Substrate, Charge 100619752 &...", Analyse durch Siemens AG, (20130918), pages 1 - 9, XP055550134-

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Dossier Documents

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