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The patent EP3266594 was granted to Technische Universitt Wien on Mar 11, 2020. The application was originally filed on Jul 7, 2016 under application number EP16450014A. The patent is currently recorded with a legal status of "Granted And Under Opposition".
A method for lithography-based additive manufacturing of three-dimensional components that combines high resolution with high throughput. The method involves irradiating material located between a construction platform and a tub floor with electromagnetic radiation in a location-selective manner, using a device that can vary the focal point volume during the manufacturing process. This allows for both high-resolution surface features and high-throughput interior structures to be achieved in a single manufacturing process.

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