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Apparatus And Method For Bonding Substrates - EP3433875

The patent EP3433875 was granted to EV Group E Thallner on May 4, 2022. The application was originally filed on Mar 22, 2016 under application number EP16711614A. The patent is currently recorded with a legal status of "Granted And Under Opposition".

EP3433875

EV GROUP E THALLNER
Application Number
EP16711614A
Filing Date
Mar 22, 2016
Status
Granted And Under Opposition
Apr 2, 2022
Publication Date
May 4, 2022
External Links
Slate, Register, Google Patents

Patent Summary

Patent Family

Patent Family

Patent Oppositions

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SUSS MICROTEC SOLUTIONSFeb 1, 2023PRINZ & PARTNER MBBADMISSIBLE

Patent Citations (23) New

Patent citations refer to prior patents cited during different phases such as opposition or international search.

Citation PhasePublication Number
DESCRIPTIONEP2655006
DESCRIPTIONEP2656378
DESCRIPTIONUS6214692
DESCRIPTIONWO2014191033
DESCRIPTIONWO2014202106
DESCRIPTIONWO2015082020
EXAMINATIONWO2010057068
EXAMINATIONWO2014191033
INTERNATIONAL-SEARCH-REPORTUS2012193009
INTERNATIONAL-SEARCH-REPORTUS2012329241
INTERNATIONAL-SEARCH-REPORTUS7682933
OPPOSITIONCN105374725
OPPOSITIONJP2002009140
OPPOSITIONJP2009010072
OPPOSITIONJP2013120901
OPPOSITIONJP2013187393
OPPOSITIONJP2015119088
OPPOSITIONJPH0766093
OPPOSITIONUS8580654
OPPOSITIONWO2010057068
OPPOSITIONWO2013137002
OPPOSITIONWO2014191033
OPPOSITIONWO2017140348

Dossier Documents

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