Semiconductor Wafer, Semiconductor Chip And Method Of Fabricating A Semiconductor Wafer - EP3557610
The patent EP3557610 was granted to Infineon Austria on Oct 23, 2019. The application was originally filed on Apr 17, 2018 under application number EP18167785A. The patent is currently recorded with a legal status of "Intended To Grant".
EP3557610
- Application Number
- EP18167785A
- Filing Date
- Apr 17, 2018
- Status
- Intended To Grant
- May 25, 2025
- Grant Date
- Oct 23, 2019
- External Links
- Slate, Register, Google Patents
Patent Summary
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Dossier Documents
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