Ceramic-Copper Circuit Substrate And Semiconductor Device Using Same - EP3606299
The patent EP3606299 was granted to Kabushiki Kaisha Toshiba on Jul 30, 2025. The application was originally filed on Mar 23, 2018 under application number EP18774710A. The patent is currently recorded with a legal status of "Patent Maintained As Amended".
EP3606299
- Application Number
- EP18774710A
- Filing Date
- Mar 23, 2018
- Status
- Patent Maintained As Amended
- Jun 27, 2025
- Grant Date
- Jul 30, 2025
- External Links
- Slate, Register, Google Patents
Patent Summary
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