Thermally-Conductive Silicone Gel Composition, Thermally-Conductive Member, And Heat Dissipation Structure - EP3660099
The patent EP3660099 was granted to DOW Toray on Sep 11, 2024. The application was originally filed on Jul 11, 2018 under application number EP18838000A. The patent is currently recorded with a legal status of "Granted And Under Opposition".
EP3660099
- Application Number
- EP18838000A
- Filing Date
- Jul 11, 2018
- Status
- Granted And Under Opposition
- Aug 8, 2024
- Grant Date
- Sep 11, 2024
- External Links
- Slate, Register, Google Patents
Patent Summary
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Patent Citations (19) New
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Non-Patent Literature (NPL) Citations (2) New
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