Thermally-Conductive Silicone Gel Composition, Thermally-Conductive Member, And Heat Dissipation Structure - EP3660101
The patent EP3660101 was granted to DOW Toray on Oct 2, 2024. The application was originally filed on Jul 11, 2018 under application number EP18838372A. The patent is currently recorded with a legal status of "Granted And Under Opposition".
EP3660101
- Application Number
- EP18838372A
- Filing Date
- Jul 11, 2018
- Status
- Granted And Under Opposition
- Aug 30, 2024
- Grant Date
- Oct 2, 2024
- External Links
- Slate, Register, Google Patents
Patent Summary
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Patent Citations (21) New
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Non-Patent Literature (NPL) Citations (1) New
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