Resin Composition, Prepreg, Laminate, Metal Foil-Clad Laminate, Printed Wiring Board, And Multilayer Printed Wiring Board - EP3733746
The patent EP3733746 was granted to Mitsubishi GAS Chemical on Aug 27, 2025. The application was originally filed on Dec 25, 2018 under application number EP18894398A. The patent is currently recorded with a legal status of "Granted And Under Opposition".
EP3733746
- Application Number
- EP18894398A
- Filing Date
- Dec 25, 2018
- Status
- Granted And Under Opposition
- Jul 25, 2025
- Publication Date
- Aug 27, 2025
- External Links
- Slate, Register, Google Patents
Patent Summary
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Dossier Documents
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