Method Of Manufacturing Semiconductor Chips Having A Side Wall Sealing - EP3987565
The patent EP3987565 was granted to Infineon Austria on Aug 20, 2025. The application was originally filed on Jun 18, 2020 under application number EP20732936A. The patent is currently recorded with a legal status of "Granted And Under Opposition".
EP3987565
- Application Number
- EP20732936A
- Filing Date
- Jun 18, 2020
- Status
- Granted And Under Opposition
- Jul 18, 2025
- Grant Date
- Aug 20, 2025
- External Links
- Slate, Register, Google Patents
Patent Summary
Patent Family
Dossier Documents
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