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Laser Reactive Cutting Method And Apparatus For Cutting A Thick Metal Workpiece - EP4201576
The patent EP4201576 was granted to Bystronic Laser on Mar 5, 2025. The application was filed on Dec 22, 2021 under application number EP21217133A. The patent is currently recorded with a legal status of "Granted And Under Opposition".
EP4201576
- Application Number
- EP21217133A
- Filing Date
- Dec 22, 2021
- Status
- Granted And Under Opposition
- Jan 31, 2025
- Publication Date
- Mar 5, 2025
- External Links
- Slate, Register, Google Patents
Patent Summary
Patent Family
Patent Oppositions
Patent oppositions filed by competitors challenge the validity of a granted patent. These oppositions are typically based on claims of prior art, lack of novelty, or non-obviousness. They are a key part of the process for determining a patent's strength and enforceability.
Patent Citations (24) New
Patent citations refer to prior patents cited during different phases such as opposition or international search.
Dossier Documents
The dossier documents provide a comprehensive record of the patent's prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent's legal journey and any challenges it may have faced during examination.
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