Conductive Paste, Laminate Body, Method Of Bonding Copper Laminate/Copper Electrode And Conductor - EP4279265
The patent EP4279265 was granted to Senju Metal Industry on Dec 25, 2024. The application was originally filed on Sep 30, 2020 under application number EP23200616A. The patent is currently recorded with a legal status of "Granted And Under Opposition".
EP4279265
- Application Number
- EP23200616A
- Filing Date
- Sep 30, 2020
- Status
- Granted And Under Opposition
- Nov 22, 2024
- Publication Date
- Dec 25, 2024
- External Links
- Slate, Register, Google Patents
Patent Summary
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Dossier Documents
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