Solder Alloy, Solder Ball, Solder Paste, And Solder Joint - EP4309841
The patent EP4309841 was granted to Senju Metal Industry on Dec 11, 2024. The application was originally filed on Jul 21, 2023 under application number EP23186981A. The patent is currently recorded with a legal status of "Granted And Under Opposition".
EP4309841
- Application Number
- EP23186981A
- Filing Date
- Jul 21, 2023
- Status
- Granted And Under Opposition
- Nov 8, 2024
- Publication Date
- Dec 11, 2024
- External Links
- Slate, Register, Google Patents
Patent Summary
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Dossier Documents
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