Chip Removal Device Chip, Placing System And Method For Removing Chips From A Wafer

Patent No. EP1470747 (titled "Chip Removal Device Chip, Placing System And Method For Removing Chips From A Wafer") was filed by ASM Assembly Systems on Jan 2, 2003. The application was issued on Dec 1, 2021.

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MUHLBAUERFeb 13, 2015SCHMIDT

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  • Date

    Description

EP1470747

ASM ASSEMBLY SYSTEMS
Application Number
EP03701466A
Filing Date
Jan 2, 2003
Status
Patent Maintained As Amended
Oct 29, 2021
Publication Date
Dec 1, 2021