Polymer Powder Containing Polyamide, Use Of Said Powder In A Moulding Method And Moulded Body Produced From The Same

Patent No. EP1745090 (titled "Polymer Powder Containing Polyamide, Use Of Said Powder In A Moulding Method And Moulded Body Produced From The Same") was filed by Degussa on Mar 21, 2005. The application was issued on Jun 25, 2014.

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ARKEMA FRANCEMar 25, 2015BANDPAY & GREUTER

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EP1745090

DEGUSSA
Application Number
EP05717111A
Filing Date
Mar 21, 2005
Status
Opposition Rejected
Mar 18, 2022
Publication Date
Jun 25, 2014