Hydrophilic Silica For Sealing Compounds

Patent No. EP1860066 (titled "Hydrophilic Silica For Sealing Compounds") was filed by Evonik Degussa on May 10, 2007. The application was issued on Feb 22, 2017.

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CompanyOpposition DateRepresentative
RHODIA OPERATIONSNov 21, 2017FERRI

Dossier Documents

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  • Date

    Description

EP1860066

EVONIK DEGUSSA
Application Number
EP07107895A
Filing Date
May 10, 2007
Status
Opposition Rejected
Apr 5, 2019
Publication Date
Feb 22, 2017