Low Basal Plane Dislocation Bulk Grown Sic Wafers

Patent No. EP1888821 (titled "Low Basal Plane Dislocation Bulk Grown Sic Wafers") was filed by Cree on Apr 5, 2006. The application was issued on Nov 19, 2014.

Patent Summary

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Patent Family

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CompanyOpposition DateRepresentative
DOW CORNINGAug 19, 2015ZIMMERMANN & PARTNER PATENTANWALTE MBB

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EP1888821

CREE
Application Number
EP06749466A
Filing Date
Apr 5, 2006
Status
Revoked
Feb 2, 2018
Publication Date
Nov 19, 2014