Electrolyte And Method For Electrolytic Deposition Of Gold-Copper Alloys

Patent No. EP1983077 (titled "Electrolyte And Method For Electrolytic Deposition Of Gold-Copper Alloys") was filed by Enthone on Apr 19, 2007. The application was issued on Dec 28, 2016.

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ICB INGENIEURS CONSEILS EN BREVETSSep 27, 2017HOFFMANN EITLE

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EP1983077

ENTHONE
Application Number
EP07007963A
Filing Date
Apr 19, 2007
Status
Granted And Under Opposition
Nov 25, 2016
Publication Date
Dec 28, 2016