Molding Material For Md Shrink And Md Shrink Film

Patent No. EP2138541 (titled "Molding Material For Md Shrink And Md Shrink Film") was filed by Denka on Feb 19, 2008. The application was issued on Mar 4, 2020.

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INEOS STYROLUTION GROUPMay 2, 2018JACOBI

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EP2138541

DENKA
Application Number
EP08711586A
Filing Date
Feb 19, 2008
Status
Patent Maintained As Amended
Jan 31, 2020
Publication Date
Mar 4, 2020