Pressure-Sensitive Adhesive Masses For Bonding Printing Plates

Patent No. EP2226372 (titled "Pressure-Sensitive Adhesive Masses For Bonding Printing Plates") was filed by Tesa on Mar 4, 2010. The application was issued on Jan 3, 2024.

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  • Date

    Description

EP2226372

TESA
Application Number
EP10155470A
Filing Date
Mar 4, 2010
Status
Patent Maintained As Amended
Dec 1, 2023
Publication Date
Jan 3, 2024