Power Semiconductor Module And Its Attachment Structure

Patent No. EP2500939 (titled "Power Semiconductor Module And Its Attachment Structure") was filed by Mitsubishi Electric on Aug 10, 2011. The application was issued on May 7, 2025.

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VALEO SYSTEMES DE CONTROLE MOTEURSep 25, 2019VALEO POWERTRAIN SYSTEMS

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EP2500939

MITSUBISHI ELECTRIC
Application Number
EP11177061A
Filing Date
Aug 10, 2011
Status
Patent Maintained As Amended
Apr 4, 2025
Publication Date
May 7, 2025