Method And Assembly For The Electrically Conductive Connection Of Wires

Patent No. EP2517315 (titled "Method And Assembly For The Electrically Conductive Connection Of Wires") was filed by Schunk Sonosystems on Nov 26, 2010. The application was issued on Aug 10, 2016.

Patent Summary

Patent Family

Patent Family

Patent Oppositions

Patent oppositions filed by competitors challenge the validity of a granted patent. These oppositions are typically based on claims of prior art, lack of novelty, or non-obviousness. They are a key part of the process for determining a patent's strength and enforceability.

CompanyOpposition DateRepresentative
TELSONIC HOLDINGMay 9, 2017HEPP WENGER RYFFEL

Dossier Documents

The dossier documents provide a comprehensive record of the patent's prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent's legal journey and any challenges it may have faced during examination.

  • Date

    Description

  • Get instant alerts for new documents

EP2517315

SCHUNK SONOSYSTEMS
Application Number
EP10788281A
Filing Date
Nov 26, 2010
Status
Opposition Rejected
Jan 4, 2019
Publication Date
Aug 10, 2016