Method And Device For Cooling Soldered Printed Circuit Boards

Patent No. EP2771145 (titled "Method And Device For Cooling Soldered Printed Circuit Boards") was filed by AIR Liquide Deutschland on Oct 22, 2012. The application was issued on Feb 22, 2017.

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Patent Oppositions

Patent oppositions filed by competitors challenge the validity of a granted patent. These oppositions are typically based on claims of prior art, lack of novelty, or non-obviousness. They are a key part of the process for determining a patent's strength and enforceability.

CompanyOpposition DateRepresentative
LINDENov 22, 2017GELLNER

Dossier Documents

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EP2771145

AIR LIQUIDE DEUTSCHLAND
Application Number
EP12775686A
Filing Date
Oct 22, 2012
Status
Opposition Rejected
Dec 30, 2018
Publication Date
Feb 22, 2017