Thermally Conductive Molded Body And Method For The Production Thereof

Patent No. EP2794970 (titled "Thermally Conductive Molded Body And Method For The Production Thereof") was filed by Zehnder Group on Dec 19, 2012. The application was issued on May 23, 2018.

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SGL CARBONFeb 22, 2019-

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EP2794970

ZEHNDER GROUP
Application Number
EP12806454A
Filing Date
Dec 19, 2012
Status
Revoked
Sep 24, 2021
Publication Date
May 23, 2018