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Flexible Substrate With Integrated Circuit

Patent No. EP2844487 (titled "Flexible Substrate With Integrated Circuit") was filed by Hewlett Packard on Apr 30, 2012. The application was issued on Mar 9, 2022.

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ARTECH DESIGN PRODUCTION IN PLASTICMay 16, 2018-

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EP2844487

HEWLETT PACKARD
Application Number
EP12875785A
Filing Date
Apr 30, 2012
Status
The Patent Has Been Limited
May 18, 2018
Publication Date
Mar 9, 2022
External Links
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