Packaged Hot-Melt Pressure Sensitive Adhesive

Patent No. EP3004272 (titled "Packaged Hot-Melt Pressure Sensitive Adhesive") was filed by H B Fuller on May 29, 2014. The application was issued on Nov 1, 2017.

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CompanyOpposition DateRepresentative
HENKELJul 31, 2018VIERING

Dossier Documents

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  • Date

    Description

EP3004272

H B FULLER
Application Number
EP14735010A
Filing Date
May 29, 2014
Status
Opposition Rejected
Apr 19, 2024
Publication Date
Nov 1, 2017