Thermoconductive Screed

Patent No. EP3008031 (titled "Thermoconductive Screed") was filed by Anhydritec on Jun 11, 2014. The application was issued on Aug 21, 2019.

Patent Summary

A floor screed composition comprising a calcium sulfate binder and a thermally conductive additive selected from silicon carbide (SiC), boron carbide (B4C), and aluminum oxide (Al2O3), with the additive present in an amount of 0.4 to 6% by weight based on the weight of the binder. The composition is suitable for use in underfloor heating systems and provides improved thermal conductivity while maintaining mechanical performance.

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CompanyOpposition DateRepresentative
KNAUF INSULATIONMay 22, 2020ZECH

Dossier Documents

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EP3008031

ANHYDRITEC
Application Number
EP14729001A
Filing Date
Jun 11, 2014
Status
Opposition Rejected
Apr 2, 2022
Publication Date
Aug 21, 2019