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High-Density Fiber Optic Modules And Module Housings And Related Equipment

Patent No. EP3096166 (titled "High-Density Fiber Optic Modules And Module Housings And Related Equipment") was filed by Corning Optical Communications on Jun 15, 2010. The application was issued on Mar 10, 2021.

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Patent Oppositions

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CompanyOpposition DateRepresentative
GRUND IPG PATENTANWALTE UND SOLICITOR PARTG MBBDec 10, 2021GRUND

Dossier Documents

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EP3096166

CORNING OPTICAL COMMUNICATIONS
Application Number
EP16176271A
Filing Date
Jun 15, 2010
Status
Granted And Under Opposition
Feb 5, 2021
Publication Date
Mar 10, 2021
External Links
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