Heat Sensitive Recording Material

Patent No. EP3109059 (titled "Heat Sensitive Recording Material") was filed by Mitsubishi Hitec Paper Europe on Jul 13, 2015. The application was issued on Jun 27, 2018.

Patent Summary

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CompanyOpposition DateRepresentative
KOEHLER OBERKIRCHMar 26, 2019MEISSNER BOLTE PARTNERSCHAFT MBB

Dossier Documents

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EP3109059

MITSUBISHI HITEC PAPER EUROPE
Application Number
EP15176526A
Filing Date
Jul 13, 2015
Status
Granted And Under Opposition
May 25, 2018
Publication Date
Jun 27, 2018