Tialcn Layers With Lamellar Structure

Patent No. EP3117021 (titled "Tialcn Layers With Lamellar Structure") was filed by Walter on Mar 3, 2015. The application was issued on Jun 6, 2018.

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KENNAMETALMar 1, 2019PRINZ & PARTNER MBB

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EP3117021

WALTER
Application Number
EP15709872A
Filing Date
Mar 3, 2015
Status
Opposition Rejected
Aug 18, 2023
Publication Date
Jun 6, 2018