IP Verse

Electroplating Bath For Electrochemical Deposition Of A Cu-Sn-Zn-Pd Alloy, Method For Electrochemical Deposition Of Said Alloy, Substrate Comprising Said Alloy And Uses Of The Substrate

Patent No. EP3150744 (titled "Electroplating Bath For Electrochemical Deposition Of A Cu-Sn-Zn-Pd Alloy, Method For Electrochemical Deposition Of Said Alloy, Substrate Comprising Said Alloy And Uses Of The Substrate") was filed by Coventya on Sep 30, 2015. The application was issued on Feb 12, 2020.

Patent Summary

Patent Family

Patent Family

Patent Oppositions

Patent oppositions filed by competitors challenge the validity of a granted patent. These oppositions are typically based on claims of prior art, lack of novelty, or non-obviousness. They are a key part of the process for determining a patent's strength and enforceability.

CompanyOpposition DateRepresentative
BLUCLADNov 11, 2020VALENZA

Dossier Documents

The dossier documents provide a comprehensive record of the patent's prosecution history - including filings, correspondence, and decisions made by patent offices - and are crucial for understanding the patent's legal journey and any challenges it may have faced during examination.

  • Date

    Description

  • Get instant alerts for new documents

EP3150744

COVENTYA
Application Number
EP15187511A
Filing Date
Sep 30, 2015
Status
Revoked
Jan 27, 2023
Publication Date
Feb 12, 2020
External Links
Slate, Register , Google Patents