IP Verse

Method And System For Forming Perforations

Patent No. EP3169635 (titled "Method And System For Forming Perforations") was filed by Corning Incorporated on Jul 14, 2015. The application was issued on Nov 23, 2022.

Patent Summary

A system for forming a contour of defects in a glass substrate (normalized pre-defect fracture toughness of 1.0) comprises a laser assembly, a moveable optical assembly, a workpiece holder, and a controller. The laser assembly provides pulses with predetermined wavelength, power, duration, and rate. The optical assembly focuses these pulses into distinct focal lines separated by predetermined distances, generating defects via induced absorption with average crack lengths. The controller executes a design to select pulse characteristics, positions, distances, crack lengths, and relative motion such that the ratio of average distance to average crack length reduces the post-defect fracture toughness along the contour to less than 1.0, creating a controlled region of mechanical weakness for subsequent separation.

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CompanyOpposition DateRepresentative
SCHOTTAug 18, 2023BLUMBACH ZINNGREBE PATENTANWALTE PARTG MBB

Dossier Documents

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  • Date

    Description

EP3169635

CORNING INCORPORATED
Application Number
EP15745643A
Filing Date
Jul 14, 2015
Status
Granted And Under Opposition
Oct 21, 2022
Publication Date
Nov 23, 2022
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