Heat Sensitive Recording Material

Patent No. EP3221153 (titled "Heat Sensitive Recording Material") was filed by Mitsubishi Hitec Paper Europe on Jun 24, 2016. The application was issued on Aug 15, 2018.

Patent Summary

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CompanyOpposition DateRepresentative
KOEHLER OBERKIRCHMay 13, 2019MEISSNER BOLTE PARTNERSCHAFT MBB

Dossier Documents

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EP3221153

MITSUBISHI HITEC PAPER EUROPE
Application Number
EP16733414A
Filing Date
Jun 24, 2016
Status
Granted And Under Opposition
Jul 13, 2018
Publication Date
Aug 15, 2018