Silica Molded Bodies Having Low Thermal Conductivity

Patent No. EP3341338 (titled "Silica Molded Bodies Having Low Thermal Conductivity") was filed by Wacker Chemie on Aug 9, 2016. The application was issued on Dec 12, 2018.

Patent Summary

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Patent Family

Patent Oppositions (2)

Patent oppositions filed by competitors challenge the validity of a granted patent. These oppositions are typically based on claims of prior art, lack of novelty, or non-obviousness. They are a key part of the process for determining a patent's strength and enforceability.

CompanyOpposition DateRepresentative
EVONIK DEGUSSAAug 23, 2019EVONIK PATENT ASSOCIATION
EVONIK OPERATIONSAug 23, 2019EVONIK PATENT ASSOCIATION

Dossier Documents

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EP3341338

WACKER CHEMIE
Application Number
EP16750162A
Filing Date
Aug 9, 2016
Status
Revoked
Jul 23, 2021
Publication Date
Dec 12, 2018