Electroplating Bath For Electrochemical Deposition Of A Cu-Sn-Zn-Pd Alloy, Method For Electrochemical Deposition Of Said Alloy, Substrate Comprising Said Alloy And Uses Of The Substrate

Patent No. EP3356579 (titled "Electroplating Bath For Electrochemical Deposition Of A Cu-Sn-Zn-Pd Alloy, Method For Electrochemical Deposition Of Said Alloy, Substrate Comprising Said Alloy And Uses Of The Substrate") was filed by Coventya on Sep 30, 2016. The application was issued on Mar 11, 2020.

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BLUCLADDec 11, 2020VALENZA

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EP3356579

COVENTYA
Application Number
EP16778284A
Filing Date
Sep 30, 2016
Status
Revoked
May 26, 2023
Publication Date
Mar 11, 2020