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Two-Package Curable Solvent-Free Adhesive For Laminates And Resin Cured Product

Patent No. EP3418343 (titled "Two-Package Curable Solvent-Free Adhesive For Laminates And Resin Cured Product") was filed by Mitsui Chemicals on Feb 16, 2017. The application was issued on Dec 27, 2023.

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COVESTRO DEUTSCHLANDSep 16, 2021LEVPAT

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EP3418343

MITSUI CHEMICALS
Application Number
EP17753263A
Filing Date
Feb 16, 2017
Status
Patent Maintained As Amended
Nov 24, 2023
Publication Date
Dec 27, 2023
External Links
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