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Recyclable Release Substrate

Patent No. EP3508545 (titled "Recyclable Release Substrate") was filed by Mitsubishi Hitec Paper Europe on Dec 18, 2018. The application was issued on May 5, 2021.

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CompanyOpposition DateRepresentative
KOEHLER INNOVATION & TECHNOLOGYFeb 4, 2022MEISSNER BOLTE PARTNERSCHAFT MBB

Dossier Documents

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EP3508545

MITSUBISHI HITEC PAPER EUROPE
Application Number
EP18213617A
Filing Date
Dec 18, 2018
Status
Granted And Under Opposition
Apr 3, 2021
Publication Date
May 5, 2021
External Links
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